Sponsored by Job CentralRSS

jobvite snags tiE50 award

Fri, May 15, 2009

News

TiEcon 2009, a large conference for entrepreneurs, announced the winners of the TiE50 Awards, and Jobvite, a provider of next-generation recruitment solutions, was one of the winners.

Selected from nearly 1,200 nominated companies, TiE reps said the winners represent the hottest emerging startups in five focus segments: Consumer Web, Internet Infrastructure, Cleantech, Wireless and Software.

Jobvite won in the software category.

“All of this year’s winners embrace TiE’s message of the bold entrepreneur,” said Mateen Syed, TiE50 Chair. “The judges were impressed by the quality of ideas and execution across each vertical segment. These fifty companies represent the finest in entrepreneurship and serve as role models encouraging and inspiring emerging startups to succeed as entrepreneurs stimulating the economy.”

You can see all the winners here.
TiE is a global, not-for-profit, non-political organization dedicated to fostering entrepreneurs across its international network sponsored by top venture capital firms and Fortune 500 corporations. TiE is spread across 53 chapters in 12 countries comprising of 1,800 entrepreneurs and business executives as charter members, 12,000 aspiring entrepreneurs and professionals as members.

Popularity: unranked [?]







Join Our Mailing List

Cheezhead's FREE Insider E-Mail (Get the Stuff Regular Readers Don't)



We're on Facebook!

Cheezhead | Promote Your Page Too
Cheezhead


Job Search

 Ex : sales, "software engineer"   Location(s) Ex : Dallas,TX or 75219 or TX
 


Related Posts



This post was written by:

Vanessa Dennis - who has written 621 posts on Cheezhead Recruiting News and Opinion.

Vanessa Dennis, originally from Austin, Texas, was a corporate recruiter for two years before becoming a writer for Cheezhead.com. Vanessa has an English Writing degree from Loyola University of New Orleans. She currently lives with her family in Cleveland. Connect with Vanessa on the Facebook Fan Site.

Contact the author

Leave a Reply